TC7SG07FE
vs
MC74VHC1GT50DTT3
feature comparison
Part Life Cycle Code |
End Of Life
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
ON SEMICONDUCTOR
|
Part Package Code |
SON
|
TSOP
|
Package Description |
VSOF,
|
TSOP, TSOP5/6,.11,37
|
Pin Count |
5
|
5
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVP
|
AHC/VHC
|
JESD-30 Code |
R-PDSO-F5
|
R-PDSO-G5
|
Length |
1.6 mm
|
3 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Number of Functions |
1
|
1
|
Number of Inputs |
1
|
1
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Characteristics |
OPEN-DRAIN
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSOF
|
TSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
Propagation Delay (tpd) |
26.7 ns
|
17.5 ns
|
Seated Height-Max |
0.6 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
0.9 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
1.2 mm
|
1.5 mm
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.008 A
|
Package Equivalence Code |
|
TSOP5/6,.11,37
|
Packing Method |
|
TR
|
Power Supply Current-Max (ICC) |
|
0.04 mA
|
Prop. Delay@Nom-Sup |
|
9.5 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
NO
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TC7SG07FE with alternatives
Compare MC74VHC1GT50DTT3 with alternatives