TC7S08FU vs HD74HC1G08CME-E feature comparison

TC7S08FU Toshiba America Electronic Components

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HD74HC1G08CME-E Renesas Electronics Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP RENESAS TECHNOLOGY CORP
Part Package Code SSOP SOIC
Package Description TSSOP, TSSOP5/6,.08 TSSOP, TSSOP5/6,.08
Pin Count 5 5
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba Renesas Electronics
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2 mm 2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.026 A 0.002 A
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 25 mA
Prop. Delay@Nom-Sup 25 ns 25 ns
Propagation Delay (tpd) 125 ns 125 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1.25 mm
Base Number Matches 9 1
Pbfree Code Yes
JESD-609 Code e6
Moisture Sensitivity Level 1
Packing Method TR
Terminal Finish TIN BISMUTH

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