TC74VHCT08FW vs MM74HCT08SJX feature comparison

TC74VHCT08FW Toshiba America Electronic Components

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MM74HCT08SJX Fairchild Semiconductor Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC SOP
Package Description SOP, SOP, SOP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AHCT/VHCT HCT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e3
Length 10.3 mm 10.2 mm
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2.1 mm
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 1 2
Manufacturer Package Code 14LD,SOP,EIAJ TYPE II, 5.3MM WIDE
ECCN Code EAR99
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code SOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 23 ns
Propagation Delay (tpd) 23 ns
Schmitt Trigger NO
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) 30

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