TC74VHCT08AFNELP,M
vs
5962G9651801Q9A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TOSHIBA CORP
AEROFLEX COLORADO SPRINGS
Package Description
SOP,
DIE,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Toshiba
Additional Feature
NOT AVAILABLE IN JAPAN
Family
AHCT/VHCT/VT
AC
JESD-30 Code
R-PDSO-G14
R-XUUC-N14
Length
8.65 mm
Logic IC Type
AND GATE
AND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SOP
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
UNCASED CHIP
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
9 ns
13 ns
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
Base Number Matches
1
2
Part Package Code
DIE
Pin Count
14
Package Equivalence Code
DIE OR CHIP
Qualification Status
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
Total Dose
500k Rad(Si) V
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