TC74VHC74FS vs HD74AC74FPEL feature comparison

TC74VHC74FS Toshiba America Electronic Components

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HD74AC74FPEL Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SSOP SOIC
Package Description LSSOP, SOP, SOP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
Family AHC/VHC AC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 10.06 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 17.5 ns 16 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.2 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 5.5 mm
fmax-Min 110 MHz 125 MHz
Base Number Matches 1 1
Pbfree Code No
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 95000000 Hz
Max I(ol) 0.012 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

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Compare HD74AC74FPEL with alternatives