TC74VHC157FS-EL
vs
74HC257D/T3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
LSSOP,
3.90 MM, PLASTIC, MS-012, SOT-109-1, SO-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
Family
AHC/VHC
HC
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
5 mm
9.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Propagation Delay (tpd)
11.5 ns
165 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
4.4 mm
3.9 mm
Base Number Matches
1
2
HTS Code
8542.39.00.01
JESD-609 Code
e4
Moisture Sensitivity Level
1
Output Characteristics
3-STATE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Compare TC74VHC157FS-EL with alternatives
Compare 74HC257D/T3 with alternatives