TC74VHC157FK
vs
TC74AC157F(TP1)
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
End Of Life
|
Ihs Manufacturer |
TOSHIBA CORP
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
VSSOP, TSSOP16,.16,20
|
SOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Toshiba
|
|
Additional Feature |
LG_MAX
|
|
Family |
AHC/VHC/H/U/V
|
AC
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Length |
4.25 mm
|
10.3 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.008 A
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
SOP
|
Package Equivalence Code |
TSSOP16,.16,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Power Supply Current-Max (ICC) |
50 mA
|
|
Prop. Delay@Nom-Sup |
9.5 ns
|
|
Propagation Delay (tpd) |
15 ns
|
10.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1.9 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
3 mm
|
5.3 mm
|
Base Number Matches |
3
|
1
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TC74VHC157FK with alternatives
Compare TC74AC157F(TP1) with alternatives