TC74VHC123AF
vs
HD74HC123AP
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP16,.3
|
DIP, DIP16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Toshiba
|
|
| Family |
AHC/VHC/H/U/V
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| Length |
10.3 mm
|
19.2 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MONOSTABLE MULTIVIBRATOR
|
MONOSTABLE MULTIVIBRATOR
|
| Number of Data/Clock Inputs |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Supply Current-Max (ICC) |
0.975 mA
|
|
| Propagation Delay (tpd) |
27.5 ns
|
300 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.9 mm
|
5.06 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
4.5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
5.3 mm
|
7.62 mm
|
| Base Number Matches |
17
|
2
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TC74VHC123AF with alternatives
Compare HD74HC123AP with alternatives