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TC74VHC08F vs 74LV08DB,112 feature comparison

TC74VHC08F Toshiba America Electronic Components

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74LV08DB,112 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family AHC/VHC LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.3 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.008 A 0.006 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP14,.3 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 9 ns 19 ns
Propagation Delay (tpd) 14 ns 33 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.9 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 5.3 mm 5.3 mm
Base Number Matches 20 1
Package Description 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Manufacturer Package Code SOT337-1
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TUBE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Logic » Gates
Logic » Gates

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Compare 74LV08DB,112 with alternatives