TC74LVX138FN(ELP)
vs
MC74LVX138MR2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
TOSHIBA CORP
MOTOROLA INC
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
3 ENABLE INPUTS
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
Input Conditioning
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
10.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
Propagation Delay (tpd)
20 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2.05 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
5.275 mm
Base Number Matches
2
1
Compare TC74LVX138FN(ELP) with alternatives
Compare MC74LVX138MR2 with alternatives