TC74LVX138FEL
vs
MC74LVX138M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA AMERICA ELECTRONIC COMPONENTS INC
ON SEMICONDUCTOR
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
Additional Feature
3 ENABLE INPUTS
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e4
Length
10.3 mm
10.2 mm
Load Capacitance (CL)
50 pF
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
260
Propagation Delay (tpd)
14 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
2.05 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.3 mm
5.275 mm
Base Number Matches
5
5
ECCN Code
EAR99
HTS Code
8542.39.00.01
Input Conditioning
STANDARD
Logic IC Type
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
Moisture Sensitivity Level
3
Package Equivalence Code
SOP16,.3
Packing Method
RAIL
Prop. Delay@Nom-Sup
14 ns
Compare TC74LVX138FEL with alternatives
Compare MC74LVX138M with alternatives