TC74LVQ74FS(EL)
vs
TC74LVQ74FN
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
TOSHIBA CORP
|
| Part Package Code |
SSOP
|
SOIC
|
| Package Description |
0.225 INCH, EIAJ TYPE1, PLASTIC, SSOP-14
|
SOP, SOP14,.25
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
LVQ
|
LVQ
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
e0
|
| Length |
5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Propagation Delay (tpd) |
16 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
4.4 mm
|
|
| fmax-Min |
65 MHz
|
|
| Base Number Matches |
4
|
5
|
| HTS Code |
|
8542.39.00.01
|
| Max Frequency@Nom-Sup |
|
65000000 Hz
|
| Max I(ol) |
|
0.012 A
|
| Package Equivalence Code |
|
SOP14,.25
|
| Prop. Delay@Nom-Sup |
|
16 ns
|
|
|
|
Compare TC74LVQ74FS(EL) with alternatives
Compare TC74LVQ74FN with alternatives