TC74LVQ32FNELP
vs
TC74LVQ32FELP
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TOSHIBA CORP
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
0.150 INCH, PLASTIC, MS-012AB, SOP-14
0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-14
Pin Count
14
14
Reach Compliance Code
unknown
unknown
Family
LVQ
LVQ
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OR GATE
OR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
240
Propagation Delay (tpd)
10 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.9 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
3.9 mm
5.3 mm
Base Number Matches
1
1
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare TC74LVQ32FNELP with alternatives
Compare TC74LVQ32FELP with alternatives