TC74LVQ273FS(SPL) vs TC74LVQ273FWEL feature comparison

TC74LVQ273FS(SPL) Toshiba America Electronic Components

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TC74LVQ273FWEL Toshiba America Electronic Components

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Part Life Cycle Code Active Active
Ihs Manufacturer TOSHIBA CORP TOSHIBA CORP
Part Package Code SSOP SOIC
Package Description LSSOP, 0.300 INCH, PLASTIC, MS-013AC, SOP-20
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family LVQ LVQ
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 6.5 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 14.5 ns 14.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.7 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 7.5 mm
fmax-Min 65 MHz 65 MHz
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TC74LVQ273FWEL with alternatives