TC74LCX257F vs SN74LVC257ARGYRG4 feature comparison

TC74LCX257F Toshiba America Electronic Components

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SN74LVC257ARGYRG4 Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC QFN
Package Description SOP, SOP16,.3 HVQCCN, LCC16/20,.14X.16,20
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PQCC-N16
Length 10.3 mm 4 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A 0.024 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVQCCN
Package Equivalence Code SOP16,.3 LCC16/20,.14X.16,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 6 ns 4.6 ns
Propagation Delay (tpd) 6.5 ns 13.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 5.3 mm 3.5 mm
Base Number Matches 10 1
JESD-609 Code e4
Moisture Sensitivity Level 2
Packing Method TR
Terminal Finish NICKEL PALLADIUM GOLD

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