TC74LCX245FK
vs
SN74LVC8T245NSRG4
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SSOP
|
SOIC
|
Pin Count |
20
|
24
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Toshiba
|
|
Control Type |
COMMON CONTROL
|
COMMON CONTROL
|
Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G24
|
Length |
5 mm
|
15 mm
|
Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
Max I(ol) |
0.024 A
|
0.024 A
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
20
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
SOP
|
Package Equivalence Code |
TSSOP20,.16,20
|
SOP24,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Prop. Delay@Nom-Sup |
7 ns
|
6.3 ns
|
Propagation Delay (tpd) |
25 ns
|
23.8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
3 mm
|
5.3 mm
|
Base Number Matches |
3
|
1
|
Package Description |
|
SOP, SOP24,.3
|
Additional Feature |
|
TWO SEPEARATE CONFIGURABLE POWER-SUPPLY RAILS FOR PORT A AND B
|
JESD-609 Code |
|
e4
|
Load Capacitance (CL) |
|
15 pF
|
Moisture Sensitivity Level |
|
1
|
Packing Method |
|
TR
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare TC74LCX245FK with alternatives
Compare SN74LVC8T245NSRG4 with alternatives