TC74LCX16373AFT(ELP)
vs
PI74LCX16373AX
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
PERICOM SEMICONDUCTOR CORP
|
Part Package Code |
TSSOP
|
TSSOP
|
Package Description |
TSSOP,
|
TSSOP, TSSOP48,.3,20
|
Pin Count |
48
|
48
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
JESD-609 Code |
e0
|
|
Length |
12.5 mm
|
12.5 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Number of Bits |
8
|
8
|
Number of Functions |
2
|
2
|
Number of Ports |
2
|
2
|
Number of Terminals |
48
|
48
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Propagation Delay (tpd) |
7 ns
|
6.4 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
6.1 mm
|
6.1 mm
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
EAR99
|
Max I(ol) |
|
0.024 A
|
Package Equivalence Code |
|
TSSOP48,.3,20
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Prop. Delay@Nom-Sup |
|
5.4 ns
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare TC74LCX16373AFT(ELP) with alternatives
Compare PI74LCX16373AX with alternatives