TC74LCX16373(SPL,F vs 74LVC16374ADL,118 feature comparison

TC74LCX16373(SPL,F Toshiba America Electronic Components

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74LVC16374ADL,118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Package Description TSSOP, 7.50 MM, PLASTIC, MO-118, SOT370-1, SSOP-48
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e4 e4
Length 12.5 mm 15.875 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 48 48
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 6.6 ns 7.5 ns
Seated Height-Max 1.2 mm 2.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.635 mm
Terminal Position DUAL DUAL
Width 6.1 mm 7.5 mm
Base Number Matches 1 1
Part Package Code SSOP
Pin Count 48
Manufacturer Package Code SOT370-1
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 100000000 Hz
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP48,.4
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 7 ns
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE

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