TC74LCX02FEL vs 74LCX02MX feature comparison

TC74LCX02FEL Toshiba America Electronic Components

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74LCX02MX onsemi

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Pbfree Code No Yes
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA AMERICA ELECTRONIC COMPONENTS INC ONSEMI
Part Package Code SOIC
Package Description SOP, SOIC-14
Pin Count 14
Reach Compliance Code unknown compliant
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 10.3 mm 8.6235 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 5.2 ns 6.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.753 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 5.3 mm 3.9 mm
Base Number Matches 1 4
Manufacturer Package Code 751EF
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TR
Prop. Delay@Nom-Sup 5.2 ns
Schmitt Trigger NO

Compare TC74LCX02FEL with alternatives

Compare 74LCX02MX with alternatives