TC74HCT573AP vs SNJ54HCT573J feature comparison

TC74HCT573AP Toshiba America Electronic Components

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SNJ54HCT573J Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP20,.3 DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-GDIP-T20
Length 24.6 mm 24.195 mm
Load Capacitance (CL) 150 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.006 A
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Prop. Delay@Nom-Sup 33 ns 53 ns
Propagation Delay (tpd) 46 ns 79 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code No
Additional Feature LG_MAX
Packing Method TUBE
Screening Level MIL-PRF-38535

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