TC74HCT573AP
vs
DV74HCT573AN
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
AVG SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP, DIP20,.3
DIP,
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDIP-T20
R-PDIP-T20
Length
24.6 mm
26.415 mm
Load Capacitance (CL)
150 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
33 ns
Propagation Delay (tpd)
46 ns
45 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
4.57 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Additional Feature
BROADSIDE VERSION OF 373
Compare TC74HCT573AP with alternatives
Compare DV74HCT573AN with alternatives