TC74HCT534AF(TP1) vs HD74HCT563FPEL feature comparison

TC74HCT534AF(TP1) Toshiba America Electronic Components

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HD74HCT563FPEL Renesas Electronics Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ENABLE TIME @ RL=1K
Family HCT HCT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 12.8 mm 12.6 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 38 ns 28 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.5 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP20,.3
Packing Method TR
Prop. Delay@Nom-Sup 28 ns

Compare TC74HCT534AF(TP1) with alternatives

Compare HD74HCT563FPEL with alternatives