TC74HCT533AF
vs
M74HCT533B1R
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP20,.3
|
DIP, DIP20,.3
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ENABLE TIME @ RL=1K
|
|
| Family |
HCT
|
HCT
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDIP-T20
|
| JESD-609 Code |
e0
|
e3
|
| Length |
12.8 mm
|
|
| Load Capacitance (CL) |
150 pF
|
150 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.006 A
|
0.006 A
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Prop. Delay@Nom-Sup |
38 ns
|
45 ns
|
| Propagation Delay (tpd) |
48 ns
|
56 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.9 mm
|
3.93 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
7.62 mm
|
| Base Number Matches |
4
|
1
|
| Packing Method |
|
TUBE
|
|
|
|
Compare TC74HCT533AF with alternatives
Compare M74HCT533B1R with alternatives