TC74HCT533AF(TP2) vs HD74HCT563FP-E feature comparison

TC74HCT533AF(TP2) Toshiba America Electronic Components

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HD74HCT563FP-E Renesas Electronics Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ENABLE TIME @ RL=1K
Family HCT HCT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e6
Length 12.8 mm 12.6 mm
Load Capacitance (CL) 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 48 ns 28 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.5 mm
Base Number Matches 1 3
Moisture Sensitivity Level 1

Compare TC74HCT533AF(TP2) with alternatives

Compare HD74HCT563FP-E with alternatives