TC74HCT258AP
vs
HD74HC258P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TOSHIBA CORP
RENESAS ELECTRONICS CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP20,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Length
19.25 mm
19.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
34 ns
145 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
5.06 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Pbfree Code
Rohs Code
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Prop. Delay@Nom-Sup
29 ns
Compare TC74HCT258AP with alternatives
Compare HD74HC258P with alternatives