TC74HCT08AF-TP2 vs GD74HCT08D feature comparison

TC74HCT08AF-TP2 Toshiba America Electronic Components

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GD74HCT08D LG Semicon Co Ltd

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code End Of Life Transferred
Ihs Manufacturer TOSHIBA CORP LG SEMICON CO LTD
Part Package Code SOIC
Package Description SOP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e0
Length 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm
Base Number Matches 1 4
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Prop. Delay@Nom-Sup 30 ns
Schmitt Trigger NO

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