TC74HCT08AF vs MM74HCT08SJ feature comparison

TC74HCT08AF Toshiba America Electronic Components

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MM74HCT08SJ onsemi

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP ON SEMICONDUCTOR
Part Package Code SOIC
Package Description SOP, SOP14,.3 SOP, SOP14,.3
Pin Count 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family HCT HCT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e3
Length 10.3 mm 10.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3 SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Prop. Delay@Nom-Sup 25 ns 23 ns
Propagation Delay (tpd) 25 ns 23 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.9 mm 2.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 1 3
Pbfree Code Yes
Manufacturer Package Code 565BE
Factory Lead Time 4 Weeks
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 1.5 mA
Time@Peak Reflow Temperature-Max (s) 30

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