TC74HCT08AF(TP2)
vs
GD74HCT08D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
TOSHIBA CORP
SK HYNIX INC
Part Package Code
SOIC
Package Description
SOP,
SOP, SOP14,.25
Pin Count
14
Reach Compliance Code
unknown
compliant
Family
HCT
HCT
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
e0
Length
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
Propagation Delay (tpd)
25 ns
30 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.3 mm
Base Number Matches
3
1
HTS Code
8542.39.00.01
Max I(ol)
0.004 A
Package Equivalence Code
SOP14,.25
Prop. Delay@Nom-Sup
30 ns
Schmitt Trigger
NO
Compare TC74HCT08AF(TP2) with alternatives
Compare GD74HCT08D with alternatives