TC74HC74AF-TP2EL vs HD74HC113P feature comparison

TC74HC74AF-TP2EL Toshiba America Electronic Components

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HD74HC113P Renesas Electronics Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC DIP
Package Description SOP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 10.3 mm 19.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP J-K FLIP-FLOP
Number of Bits 1 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 38 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 5.06 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE NEGATIVE EDGE
Width 5.3 mm 7.62 mm
fmax-Min 25 MHz
Base Number Matches 1 2

Compare TC74HC74AF-TP2EL with alternatives

Compare HD74HC113P with alternatives