TC74HC73AF(TP2)
vs
5962-9314801Q2X
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOSHIBA CORP
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
SOIC
|
QLCC
|
| Package Description |
0.300 INCH, PLASTIC, SOIC-14
|
QCCN,
|
| Pin Count |
14
|
20
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
MASTER SLAVE OPERATION
|
WITH HOLD MODE
|
| Family |
HC/UH
|
ABT
|
| JESD-30 Code |
R-PDSO-G14
|
S-CQCC-N20
|
| Length |
10.3 mm
|
8.89 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
J-K FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
2
|
8
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
14
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Propagation Delay (tpd) |
31 ns
|
7.6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.9 mm
|
1.905 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
NEGATIVE EDGE
|
POSITIVE EDGE
|
| Width |
5.3 mm
|
8.89 mm
|
| fmax-Min |
24 MHz
|
150 MHz
|
| Base Number Matches |
1
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Screening Level |
|
MIL-PRF-38535 Class Q
|
|
|
|
Compare TC74HC73AF(TP2) with alternatives
Compare 5962-9314801Q2X with alternatives