TC74HC573AF(TP2) vs MC74HC573AFEL feature comparison

TC74HC573AF(TP2) Toshiba America Electronic Components

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MC74HC573AFEL onsemi

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP ON SEMICONDUCTOR
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
Additional Feature BROADSIDE VERSION OF 373; ENABLE TIME @ RL=1K
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e4
Length 12.8 mm 12.575 mm
Load Capacitance (CL) 150 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 39 ns 240 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2.05 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm 5.275 mm
Base Number Matches 3 2
HTS Code 8542.39.00.01
Max I(ol) 0.006 A
Moisture Sensitivity Level 3
Package Equivalence Code SOP20,.3
Packing Method TR
Prop. Delay@Nom-Sup 45 ns

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