TC74HC51AF(EL) vs HD74HC51FPEL feature comparison

TC74HC51AF(EL) Toshiba America Electronic Components

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HD74HC51FPEL Renesas Electronics Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP RENESAS TECHNOLOGY CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
Additional Feature ASYMMETRICAL I/P'S
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.3 mm 10.06 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND-OR-INVERT GATE AND-OR-INVERT GATE
Number of Functions 2 2
Number of Inputs 6 6
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 25 ns 140 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 5.3 mm 5.5 mm
Base Number Matches 1 1
HTS Code 8542.39.00.01
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.3
Packing Method TR
Prop. Delay@Nom-Sup 28 ns
Schmitt Trigger NO

Compare TC74HC51AF(EL) with alternatives

Compare HD74HC51FPEL with alternatives