TC74HC4511AP vs HEF4555BTD feature comparison

TC74HC4511AP Toshiba America Electronic Components

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HEF4555BTD NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family HC/UH 4000/14000/40000
Input Conditioning LATCHED STANDARD
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.25 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type SEVEN SEGMENT DECODER/DRIVER 2-LINE TO 4-LINE DECODER
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 300 ns 280 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 15 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 3.9 mm
Base Number Matches 2 2
JESD-609 Code e4
Max I(ol) 0.00035999999999999997 A
Moisture Sensitivity Level 1
Prop. Delay@Nom-Sup 295 ns
Terminal Finish NICKEL PALLADIUM GOLD

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