TC74HC4351AF
vs
CD74HC4351E
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TOSHIBA CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP20,.3
|
DIP-20
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
12.8 mm
|
|
| Neg Supply Voltage-Nom (Vsup) |
-6 V
|
|
| Number of Channels |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Off-state Isolation-Nom |
50 dB
|
|
| On-state Resistance Match-Nom |
5 Ω
|
|
| On-state Resistance-Max (Ron) |
100 Ω
|
225 Ω
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.8 mm
|
|
| Signal Current-Max |
0.025 A
|
0.025 A
|
| Supply Current-Max (Isup) |
0.08 mA
|
0.16 mA
|
| Supply Voltage-Nom (Vsup) |
6 V
|
6 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
47 ns
|
|
| Switch-on Time-Max |
34 ns
|
300 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
|
| Base Number Matches |
1
|
5
|
|
|
|
Compare TC74HC4351AF with alternatives