TC74HC4075AP vs SN74LVC86ADGV feature comparison

TC74HC4075AP Toshiba America Electronic Components

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SN74LVC86ADGV Texas Instruments

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 TSSOP, TSSOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH LVC/LCX/Z
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.25 mm 4.4 mm
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE XOR GATE
Max I(ol) 0.004 A
Number of Functions 3 4
Number of Inputs 3 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP14,.3 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 23 ns
Propagation Delay (tpd) 115 ns 13.6 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.45 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 4.5 V 1.8 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.4 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 3.6 mm
Base Number Matches 2 2

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Compare SN74LVC86ADGV with alternatives