TC74HC4066AFN-TP2ELP
vs
CD54HC4066F3A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
SOP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDSO-G14
R-GDIP-T14
Length
8.65 mm
Neg Supply Voltage-Nom (Vsup)
Number of Channels
1
1
Number of Functions
4
4
Number of Terminals
14
14
Off-state Isolation-Nom
60 dB
On-state Resistance Match-Nom
5 Ω
On-state Resistance-Max (Ron)
80 Ω
142 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Current-Max (Isup)
0.08 mA
0.16 mA
Supply Voltage-Nom (Vsup)
12 V
6 V
Surface Mount
YES
NO
Switch-off Time-Max
24 ns
Switch-on Time-Max
12 ns
20 ns
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
Base Number Matches
1
1
JESD-609 Code
e0
Normal Position
NO
Output
SEPARATE OUTPUT
Package Equivalence Code
DIP14,.3
Switching
MAKE-BEFORE-BREAK
Terminal Finish
TIN LEAD
Compare TC74HC4066AFN-TP2ELP with alternatives
Compare CD54HC4066F3A with alternatives