TC74HC4066AFN(ELP)
vs
CD4053BCN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SOIC
DIP
Package Description
SOP, SOP14,.25
0.300 INCH, PLASTIC, MS-001, DIP-16
Pin Count
14
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SINGLE-ENDED MULTIPLEXER
JESD-30 Code
R-PDSO-G14
R-PDIP-T16
Length
8.65 mm
19.305 mm
Neg Supply Voltage-Nom (Vsup)
Normal Position
NO
Number of Channels
1
2
Number of Functions
4
3
Number of Terminals
14
16
Off-state Isolation-Nom
60 dB
On-state Resistance Match-Nom
5 Ω
10 Ω
On-state Resistance-Max (Ron)
80 Ω
1050 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP14,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.08 mm
Supply Current-Max (Isup)
0.08 mA
Supply Voltage-Nom (Vsup)
12 V
5 V
Surface Mount
YES
NO
Switch-off Time-Max
18 ns
420 ns
Switch-on Time-Max
12 ns
1200 ns
Switching
MAKE-BEFORE-BREAK
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
7.62 mm
Base Number Matches
1
2
JESD-609 Code
e3
Neg Supply Voltage-Max (Vsup)
Neg Supply Voltage-Min (Vsup)
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
5 V
Terminal Finish
MATTE TIN
Compare TC74HC4066AFN(ELP) with alternatives
Compare CD4053BCN with alternatives