TC74HC4066AFN(ELP) vs 74HC4066D,652 feature comparison

TC74HC4066AFN(ELP) Toshiba America Electronic Components

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74HC4066D,652 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 3.90 MM, PLASTIC, SOT-108-1, MS-012, SO-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Neg Supply Voltage-Nom (Vsup)
Normal Position NO NO
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 60 dB 50 dB
On-state Resistance Match-Nom 5 Ω 5 Ω
On-state Resistance-Max (Ron) 80 Ω 142 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output SEPARATE OUTPUT SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Current-Max (Isup) 0.08 mA
Supply Voltage-Nom (Vsup) 12 V 4.5 V
Surface Mount YES YES
Switch-off Time-Max 18 ns 45 ns
Switch-on Time-Max 12 ns 30 ns
Switching MAKE-BEFORE-BREAK MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Manufacturer Package Code SOT108-1
JESD-609 Code e4
Moisture Sensitivity Level 1
Supply Voltage-Max (Vsup) 10 V
Supply Voltage-Min (Vsup) 2 V
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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Compare 74HC4066D,652 with alternatives