TC74HC4066AF-TP1EL vs CD4053BCN feature comparison

TC74HC4066AF-TP1EL Toshiba America Electronic Components

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CD4053BCN Texas Instruments

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC
Package Description SOP, DIP, DIP16,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDSO-G14 R-PDIP-T16
JESD-609 Code e0 e0
Length 10.3 mm 19.304 mm
Neg Supply Voltage-Nom (Vsup) -7.5 V
Number of Channels 1 1
Number of Functions 4 3
Number of Terminals 14 16
Off-state Isolation-Nom 60 dB 40 dB
On-state Resistance Match-Nom 5 Ω 5 Ω
On-state Resistance-Max (Ron) 80 Ω 240 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 5.08 mm
Supply Current-Max (Isup) 0.08 mA
Supply Voltage-Nom (Vsup) 12 V 7.5 V
Surface Mount YES NO
Switch-off Time-Max 24 ns 150 ns
Switch-on Time-Max 12 ns 320 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.62 mm
Base Number Matches 1 4
Switching BREAK-BEFORE-MAKE

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