TC74HC4050AFN
vs
74HC4050NB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
0.150 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOL-16
DIP,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
kg CO2e/kg
12.4
Average Weight (mg)
473.2
CO2e (mg)
5867.68
Category CO2 Kg
12.4
Compliance Temperature Grade
Industrial: -40C to +85C
EU RoHS Version
RoHS 2 (2011/65/EU)
Conflict Mineral Status
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
Conflict Minerals Statement
Additional Feature
NOT AVAILABLE IN JAPAN
CMOS-TTL LEVEL TRANSLATOR
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
Length
9.9 mm
19.025 mm
Load Capacitance (CL)
150 pF
50 pF
Logic IC Type
BUFFER
BUFFER
Max I(ol)
0.006 A
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
19 ns
Propagation Delay (tpd)
145 ns
26 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.75 mm
4.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
7.62 mm
Base Number Matches
9
1
JESD-609 Code
e4
Terminal Finish
NICKEL PALLADIUM GOLD
Compare TC74HC4050AFN with alternatives
Compare 74HC4050NB with alternatives