TC74HC373AFW-TP1ELP vs MM74HC373WMX feature comparison

TC74HC373AFW-TP1ELP Toshiba America Electronic Components

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MM74HC373WMX Fairchild Semiconductor Corporation

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Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC SOIC
Package Description SOP, 0.300 INCH, MS-013, SOIC-20
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 12.8 mm 12.8015 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 31 ns 280 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.7 mm 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.5 mm 7.5 mm
Base Number Matches 1 5
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code 20LD, SOIC, JEDEC MS013, .300", WIDE BODY
ECCN Code EAR99
JESD-609 Code e3
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP20,.4
Packing Method TR
Prop. Delay@Nom-Sup 37 ns
Terminal Finish MATTE TIN

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