TC74HC367AFN-TP1ELP vs CD74HC367M96G4 feature comparison

TC74HC367AFN-TP1ELP Toshiba America Electronic Components

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CD74HC367M96G4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 6 4
Number of Functions 1 2
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 24 ns 160 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Control Type ENABLE LOW
JESD-609 Code e4
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 32 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare TC74HC367AFN-TP1ELP with alternatives

Compare CD74HC367M96G4 with alternatives