TC74HC32AFN-TP2ELP vs SN74LS32DR2 feature comparison

TC74HC32AFN-TP2ELP Toshiba America Electronic Components

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SN74LS32DR2 Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code SOIC
Package Description SOP, SOP, SOP14,.25
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e2 e0
Length 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 19 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN COPPER/TIN SILVER Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 1 5
Rohs Code No
Max I(ol) 0.008 A
Package Equivalence Code SOP14,.25
Packing Method TAPE AND REEL
Power Supplies 5 V
Power Supply Current-Max (ICC) 9.8 mA
Prop. Delay@Nom-Sup 22 ns
Schmitt Trigger NO

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