TC74HC32AFN(TP1) vs SN74LS32N feature comparison

TC74HC32AFN(TP1) Toshiba America Electronic Components

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SN74LS32N Freescale Semiconductor

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Lifetime Buy Transferred
Ihs Manufacturer TOSHIBA CORP FREESCALE SEMICONDUCTOR INC
Part Package Code SOIC DIP
Package Description 0.150 INCH, PLASTIC, SOIC-14 PLASTIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
Family HC/UH LS
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm 18.86 mm
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 19 ns 22 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.69 mm
Supply Voltage-Max (Vsup) 6 V 5.25 V
Supply Voltage-Min (Vsup) 2 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 3 4
HTS Code 8542.39.00.01

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