TC74HC32AFN(TP1) vs DV74HC32AD feature comparison

TC74HC32AFN(TP1) Toshiba America Electronic Components

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DV74HC32AD avg Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Lifetime Buy Obsolete
Ihs Manufacturer TOSHIBA CORP AVG SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description 0.150 INCH, PLASTIC, SOIC-14 SOP, SOP14(UNSPEC)
Pin Count 14 14
Reach Compliance Code unknown unknown
Category CO2 Kg 12.4
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240
Propagation Delay (tpd) 19 ns 110 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 3 1
HTS Code 8542.39.00.01
Max I(ol) 0.004 A
Package Equivalence Code SOP14(UNSPEC)
Prop. Delay@Nom-Sup 22 ns
Schmitt Trigger NO

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