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TC74HC259AF(TP1) vs 74HC259DB,118 feature comparison

TC74HC259AF(TP1) Toshiba America Electronic Components

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74HC259DB,118 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description 0.300 INCH, PLASTIC, SOIC-16 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
Additional Feature 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH 1:8 DMUX FOLLOWED BY LATCH
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 10.3 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D LATCH D LATCH
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 260
Propagation Delay (tpd) 41 ns 255 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Trigger Type LOW LEVEL LOW LEVEL
Width 5.3 mm 5.3 mm
Base Number Matches 1 2
Manufacturer Package Code SOT338-1
HTS Code 8542.39.00.01
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP16,.3
Packing Method TR
Prop. Delay@Nom-Sup 56 ns
Logic » FF/Latches
Logic » FF/Latches

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Compare 74HC259DB,118 with alternatives