TC74HC257AF(TP2)
vs
HD74HC157T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TOSHIBA CORP
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOIC
Package Description
0.300 INCH, PLASTIC, SOP-16
TSSOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
Length
10.3 mm
5 mm
Load Capacitance (CL)
150 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Propagation Delay (tpd)
35 ns
155 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
1.1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
5.3 mm
4.4 mm
Base Number Matches
1
2
HTS Code
8542.39.00.01
Compare TC74HC257AF(TP2) with alternatives
Compare HD74HC157T with alternatives