TC74HC251AP
vs
CD74HC251MT
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP16,.3
|
GREEN, PLASTIC, MS-012AC, SOIC-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Toshiba
|
Texas Instruments
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| Length |
19.25 mm
|
9.9 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.0052 A
|
0.0052 A
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
8
|
8
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Supply Current-Max (ICC) |
50 mA
|
0.16 mA
|
| Prop. Delay@Nom-Sup |
35 ns
|
21 ns
|
| Propagation Delay (tpd) |
175 ns
|
370 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.45 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
2
|
| Packing Method |
|
TR
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
|
|
Compare TC74HC251AP with alternatives
Compare CD74HC251MT with alternatives