TC74HC251AF-TP1 vs SN74HC251NSRE4 feature comparison

TC74HC251AF-TP1 Toshiba America Electronic Components

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SN74HC251NSRE4 Texas Instruments

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 10.3 mm 10.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 1
Number of Inputs 8 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 45 ns 375 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 1 2
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 49 ns
Time@Peak Reflow Temperature-Max (s) 30

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