TC74HC221AP
vs
74HC221N,652
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
End Of Life
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP-16
|
DIP, DIP16,.3
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
Length |
19.25 mm
|
21.6 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MONOSTABLE MULTIVIBRATOR
|
MONOSTABLE MULTIVIBRATOR
|
Moisture Sensitivity Level |
1
|
|
Number of Data/Clock Inputs |
2
|
2
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
265 ns
|
54 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.45 mm
|
4.7 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
3
|
1
|
Manufacturer Package Code |
|
SOT38-4
|
Additional Feature |
|
NON-RETRIGGERABLE; TRIGGERABLE FROM CLEAR INPUT ALSO
|
JESD-609 Code |
|
e4
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare TC74HC221AP with alternatives
Compare 74HC221N,652 with alternatives